CIA module 5

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Across
  1. 3. Patterned layer that defines regions for etching or exposure
  2. 7. PVD process that vaporizes a source material and condenses it on a substrate
  3. 9. Etching that proceeds preferentially in a specific direction
  4. 10. Condition indicating that the required etching depth or layer has been reached
  5. 11. Starting chemical supplied to form a deposited film in a process
  6. 14. Material removal using gas or plasma in a vacuum system
  7. 16. Material removal using a liquid chemical solution
  8. 17. Deposition process in which gaseous precursors react to form a solid film
  9. 19. Technique that uses a directed beam of ions to remove surface material
  10. 20. Ability of a deposited film to coat surfaces and features uniformly
Down
  1. 1. Planarization method using chemical reactions and mechanical polishing
  2. 2. Removal of material from a surface to create patterns
  3. 4. PVD process that ejects atoms from a target using energetic ions
  4. 5. Film deposition method based on physical transfer of material from a source
  5. 6. Light-sensitive coating used to transfer patterns onto a wafer
  6. 8. Process of reducing surface height variations to create a flatter surface
  7. 12. Etching that proceeds at approximately the same rate in all directions
  8. 13. Ratio describing how preferentially one material is etched over another
  9. 15. Etching technique that combines reactive chemistry with ion bombardment
  10. 18. Ionized gas containing charged particles used in semiconductor processing