ICDET

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Across
  1. 3. Process that provides high packing density
  2. 5. Logic family that uses least power compared to PMOS or NMOS
  3. 6. IC design step after completing design entry
  4. 8. Percentage of good dies over total number of dies
  5. 9. Technology that use both BJT and MOSFETs
  6. 10. Advantages: Occupy ____ area
  7. 11. Significant improvements in IC processing
Down
  1. 1. Number of transistors <1,000,000
  2. 2. One of the process in Design Phase
  3. 4. Material that has better temperature characteristic
  4. 5. Advantages: Less power ______
  5. 7. Maximum chip size is limited due to ____ in wafer