ICDET

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Across
  1. 3. Maximum chip size is limited due to ____ in wafer
  2. 5. One of the process in Design Phase
  3. 7. IC design step after completing design entry
  4. 10. Technology that use both BJT and MOSFETs
  5. 11. Significant improvements in IC processing
  6. 12. Material that has better temperature characteristic
Down
  1. 1. Number of transistors <1,000,000
  2. 2. Advantages: Occupy ____ area
  3. 4. Advantages: Less power ______
  4. 6. Logic family that uses least power compared to PMOS or NMOS
  5. 8. Process that provides high packing density
  6. 9. Percentage of good dies over total number of dies