ICDET

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Across
  1. 4. Material that has better temperature characteristic
  2. 6. Logic family that uses least power compared to PMOS or NMOS
  3. 7. Advantages: Less power ______
  4. 9. Number of transistors <1,000,000
  5. 10. Process that provides high packing density
  6. 12. Advantages: Occupy ____ area
Down
  1. 1. Technology that use both BJT and MOSFETs
  2. 2. IC design step after completing design entry
  3. 3. Maximum chip size is limited due to ____ in wafer
  4. 5. Significant improvements in IC processing
  5. 8. One of the process in Design Phase
  6. 11. Percentage of good dies over total number of dies