ICDET

123456789101112
Across
  1. 2. Process that provides high packing density
  2. 6. Percentage of good dies over total number of dies
  3. 7. Material that has better temperature characteristic
  4. 9. Advantages: Less power ______
  5. 12. Technology that use both BJT and MOSFETs
Down
  1. 1. Advantages: Occupy ____ area
  2. 3. Maximum chip size is limited due to ____ in wafer
  3. 4. Number of transistors <1,000,000
  4. 5. Significant improvements in IC processing
  5. 8. Logic family that uses least power compared to PMOS or NMOS
  6. 10. IC design step after completing design entry
  7. 11. One of the process in Design Phase