ICDET

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Across
  1. 2. Process that provides high packing density
  2. 3. Technology that use both BJT and MOSFETs
  3. 6. Advantages: Occupy ____ area
  4. 7. IC design step after completing design entry
  5. 8. Significant improvements in IC processing
  6. 10. Logic family that uses least power compared to PMOS or NMOS
Down
  1. 1. Number of transistors <1,000,000
  2. 2. One of the process in Design Phase
  3. 4. Advantages: Less power ______
  4. 5. Maximum chip size is limited due to ____ in wafer
  5. 7. Material that has better temperature characteristic
  6. 9. Percentage of good dies over total number of dies