Team Challenge 2: Crossword Puzzle

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Across
  1. 3. Term for combining multiple chip technologies in a single package (2 words: 12,11)
  2. 6. Power electronics material enabling EV inverters (abbr., 3)
  3. 7. The key customer for Smart Devices’ productivity analytics device (7)
  4. 8. The advanced packaging term that describes stacking chips on top of each other (4)
  5. 10. The international organization setting strict PFAS regulations (4)
  6. 11. North American chipmaker helping us enter logic packaging (5)
Down
  1. 1. Taiwanese city known as the epicenter of advanced semiconductor packaging (7)
  2. 2. The Brewer Science department responsible for exploring adjacencies and long-term trends (3)
  3. 4. CUF stands for Capillary Flow _______ (9)
  4. 5. The global consortium focused on panel-level packaging innovation (6)
  5. 9. The process of separating wafers into individual chips (6)