CIA 5 - Etching Technologies

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Across
  1. 6. Step in CVD where reactant species attach to a surface.
  2. 7. Step in CVD where reaction products leave the surface.
  3. 9. Uses a magnetic field to improve electron confinement during sputtering.
  4. 10. Process of making the wafer surface flat.
Down
  1. 1. Supports the wafer inside a CVD reactor.
  2. 2. Deposition process performed at low pressure.
  3. 3. Ability of a thin film to coat surface features evenly.
  4. 4. PVD process that ejects atoms from a target using energetic ions.
  5. 5. Controls the direction of sputtered atoms reaching the wafer.
  6. 8. Chemical and abrasive mixture used during CMP.