CIA MODULE 5

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Across
  1. 5. Reaction that forms an oxide layer on a material surface
  2. 7. Mechanical action used to smooth a material surface
  3. 10. Electrically insulating material commonly used in semiconductor devices
  4. 12. Protecting selected surface regions from being etched
  5. 13. Electrical potential applied to influence ion energy at a wafer surface
  6. 14. Solid source material bombarded by ions during sputter deposition
  7. 15. Thin slice of semiconductor material used to fabricate integrated circuits
Down
  1. 1. Process of forming a thin layer of material on a surface
  2. 2. Localized protection that causes unwanted tiny surface features during etching
  3. 3. Measure of how consistently a film thickness or etch depth is distributed
  4. 4. Lateral removal of material beneath a mask during etching
  5. 6. Enclosed vessel in which semiconductor etching or deposition takes place
  6. 8. Chemical process involving species that react with the material being etched
  7. 9. Base surface on which a thin film is deposited
  8. 11. Amount of material removed per unit time during etching