Across
- 2. Process of transferring a geometric pattern onto a semiconductor wafer
- 3. Rate at which process gas is supplied to a reaction chamber
- 5. Low-pressure environment used in many dry etching and deposition systems
- 7. Liquid used to dissolve or clean away certain materials or residues
- 9. Highly reactive neutral species that can participate in plasma etching
- 11. Equipment used to align a photomask with a wafer
- 14. Cross-sectional shape of a feature formed by etching
- 15. Chemical substance used to remove material during wet etching
- 17. Material used to protect selected regions during a fabrication process
- 18. Equipment that converts source material into vapor for physical deposition
- 19. Initial formation of small stable clusters during thin-film growth
- 20. Removal of material extending beneath a patterned protective layer
Down
- 1. Material that settles again on a surface after being removed during processing
- 4. Vertical or sloped surface along the edge of an etched feature
- 6. Consistency of etch depth or deposited film thickness across a wafer
- 8. Distance between the top and bottom surfaces of a thin film
- 10. Process by which atoms or molecules become electrically charged
- 12. Attraction that helps a deposited film remain attached to its substrate
- 13. Localized concave removal of material during chemical-mechanical planarization
- 16. Physical removal of atoms from a solid target by energetic particle bombardment