Across
- 2. Technology that use both BJT and MOSFETs
- 4. Maximum chip size is limited due to ____ in wafer
- 6. Advantages: Occupy ____ area
- 8. Number of transistors <1,000,000
- 10. Significant improvements in IC processing
- 11. Process that provides high packing density
Down
- 1. Advantages: Less power ______
- 3. Percentage of good dies over total number of dies
- 5. IC design step after completing design entry
- 6. Material that has better temperature characteristic
- 7. Logic family that uses least power compared to PMOS or NMOS
- 9. One of the process in Design Phase