Across
- 4. Advantages: Less power ______
- 7. Number of transistors <1,000,000
- 8. IC design step after completing design entry
- 9. Process that provides high packing density
- 10. Percentage of good dies over total number of dies
- 11. One of the process in Design Phase
Down
- 1. Maximum chip size is limited due to ____ in wafer
- 2. Significant improvements in IC processing
- 3. Logic family that uses least power compared to PMOS or NMOS
- 5. Material that has better temperature characteristic
- 6. Technology that use both BJT and MOSFETs
- 8. Advantages: Occupy ____ area