Across
- 1. The bake removes moisture before storage or shipment.
- 4. Included in shipment that reference ship to customer, customer P.O. #, internal S.O., routing instructions, shiip to and bill to addresses, and product description and quality.
- 7. Material supplied by the customer.
- 9. Foundational document provided by the customer that defines the projects requirements.
- 10. A test or series of tests used to determine the sum of external influences affecting the structural, mechanical, and functional integrity of any given package or assembly.
- 11. A very stringent, exactly defined military specification that defines the test method and defect criteria for assembly of IC's.
- 12. Changes in the scope of work.
- 13. Notes provided to the Shipping Department indicating specific instructions from the customer pertaining to how the devices should be shipped.
- 15. An individual integrated circuit or discrete device.
- 16. A notch or dot on a device that means how to insert the device in the socket.
- 17. The objective of this test is to determine the ability of the package to withstand rapid changes of temperature within an air environment.
Down
- 2. The purpose of this test is to measure bond strength.
- 3. A problem occurs in the process of testing a device Lot, which prevents the completion of the lot testing, or if an unexpected fail rate of greater than 10% occurs.
- 5. If a revised customer specification, SOW or document is received, customer service will verify if review by configuration management is required.
- 6. A set of step-by-step instructions complied by Integra to help employees carry out complex routine operations.
- 7. The duration from the start of the new load to the start of the next new load.
- 8. Devices that no longer meet the customer's or manufacturer's physical requirements.
- 14. A method of packing devices prior to shipment.