Across
- 4. Semiconductor company co-founded by Gordon Moore and Robert Noyce
- 6. Testing performed at the operating wavelength
- 7. Sudden transfer of electrical charge between objects at different potentials
- 12. 193nm, 213nm, or 248nm, for instance
- 13. Process used to project patterns onto a wafer
- 14. Patterned template used in lithography to transfer circuit designs onto a wafer
- 15. Inspection technique based on reflected light
- 17. Next-generation development project for hybridized sensor technology
- 19. 13.5nm, e.g.
- 21. Base substrate from which chips are fabricated
- 22. Surface defect caused by mechanical damage, commonly detected during wafer inspection
Down
- 1. Protective membrane suspended above a photomask
- 2. Image sensor technology using active pixel circuitry
- 3. Codename of a large-format camera developed for EUV mask inspection
- 5. Codename of a high-performance wafer inspection line-scan camera
- 8. Inspection technique based on scattered light
- 9. Tiny contaminant that can ruin a semiconductor device
- 10. World's largest chip manufacturer
- 11. Intended geometric feature printed onto a device or mask
- 14. DUV mask inspection camera named after a Canadian canal
- 16. Imaging modality based on scanning an object, often used to inspect photomasks
- 18. Chip manufacturing step that selectively removes material
- 20. Image sensor technology, or, looped into an email chain
