Team Challenge 2: Crossword Puzzle

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Across
  1. 3. integration Term for combining multiple chip technologies in a single package (2 words: 12,11)
  2. 6. The advanced packaging term that describes stacking chips on top of each other (4)
  3. 8. The Brewer Science department responsible for exploring adjacencies and long-term trends (3)
  4. 9. CUF stands for Capillary Flow _______ (9)
  5. 11. The key customer for Smart Devices’ productivity analytics device (7)
Down
  1. 1. Taiwanese city known as the epicenter of advanced semiconductor packaging (7)
  2. 2. The global consortium focused on panel-level packaging innovation (6)
  3. 4. Power electronics material enabling EV inverters (abbr., 3)
  4. 5. The process of separating wafers into individual chips (6)
  5. 7. North American chipmaker helping us enter logic packaging (5)
  6. 10. The international organization setting strict PFAS regulations (4)