Team Challenge 2: Crossword Puzzle

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Across
  1. 3. The process of separating wafers into individual chips (6)
  2. 4. The global consortium focused on panel-level packaging innovation (6)
  3. 5. North American chipmaker helping us enter logic packaging (5)
  4. 6. Power electronics material enabling EV inverters (abbr., 3)
  5. 7. The advanced packaging term that describes stacking chips on top of each other (4)
  6. 8. The key customer for Smart Devices’ productivity analytics device (7)
  7. 9. The Brewer Science department responsible for exploring adjacencies and long-term trends (3)
  8. 11. Taiwanese city known as the epicenter of advanced semiconductor packaging (7)
Down
  1. 1. Term for combining multiple chip technologies in a single package (2 words: 12,11)
  2. 2. CUF stands for Capillary Flow _______ (9)
  3. 10. The international organization setting strict PFAS regulations (4)