Across
- 3. Process that provides high packing density
- 5. Logic family that uses least power compared to PMOS or NMOS
- 6. IC design step after completing design entry
- 8. Percentage of good dies over total number of dies
- 9. Technology that use both BJT and MOSFETs
- 10. Advantages: Occupy ____ area
- 11. Significant improvements in IC processing
Down
- 1. Number of transistors <1,000,000
- 2. One of the process in Design Phase
- 4. Material that has better temperature characteristic
- 5. Advantages: Less power ______
- 7. Maximum chip size is limited due to ____ in wafer